Toshiba America Electronic Components, Inc. announced its free positioning wireless charging chipset consisting of a high-efficiency power transmitter and receiver for charging smartphones and other mobile products anywhere on the battery charging pad. The Toshiba chipset is fully compliant with the Wireless Power Consortium (WPC) Qi interface specification, A4, A8, A12 and A14.
Aldec, Inc. now supports ARM dual-core Cortex-A9 MPCore application development and verification in its HES-7 ASIC prototyping platform. HES-7 leverages Xilinx Virtex-7 2000T and Zynq-7000 All Programmable SoC and includes peripherals supporting media interfaces, memories and additional connectors to expand the development of a wide array of SoC applications.
Microsemi Corporation, a provider of semiconductor solutions, introduced a 5 gigahertz (GHz) LX5509 power amplifier (PA) for IEEE 802.11ac—also known as fifth generation Wi-Fi—wireless access points and media devices. The LX5509 is the first commercially available PA that can transmit at similar power levels in both IEEE 802.11n and IEEE 802.11ac networks, allowing optimum system performance by extending the high data rate range.
ClearOne today announced the release of its new WS800 Digital Wireless Microphone System to complement its professionally installed audio conferencing product lines. The microphone system uses radio-frequency digital wireless signal transmission technology with secure encryption and is optimized to work with CONVERGE Pro and INTERACT Pro products.
ZTE Corporation, a publicly listed global provider of telecommunications equipment, network solutions and devices, today announced that the company will enhance its presence in the U.S. market by increasing its investment by $30 million. ZTE will use this $30 million to work with a number of local partners to tap into both core and innovative technologies in the telecommunications industry.